A new DARPA- and Texas-backed facility will focus on 3D heterogeneous integration, stacking, and combining multiple materials and chip types to advance U.S. capabilities in defense, AI, and HPC.
Archived version: https://archive.is/newest/https://www.tomshardware.com/darpa-invests-1-4-billion-to-build-texas-foundry-for-next-gen-3d-chip-integration
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