depends on the type of solder but yeah, I’m not exactly holding it there tho. just high airflow at that temp for a few seconds to push the rosin underneath the chips. helps a lot with bga chips where water can actually get underneath the chip and short connections or leave debris even once evaporated. for actually reworking chips I use around 480c.
depends on the type of solder but yeah, I’m not exactly holding it there tho. just high airflow at that temp for a few seconds to push the rosin underneath the chips. helps a lot with bga chips where water can actually get underneath the chip and short connections or leave debris even once evaporated. for actually reworking chips I use around 480c.