LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.
Don’t worry, you aren’t the only one, the tomshardware article had the same misunderstanding.
The only thing this change does is that the pads of the chip packages can be spaced tighter together, which allows the packages of the chips to be smaller sideways. It doesn’t change the height of the chips.
And yet not only did the original article misunderstand that sideways isn’t height, they also thought that making the chip packages narrower will directly lead to the phone getting slimmer.
“It allows to shrink sideways” sounded like it was referring to phone dimensions. I must have misunderstood what you were saying.
Don’t worry, you aren’t the only one, the tomshardware article had the same misunderstanding.
The only thing this change does is that the pads of the chip packages can be spaced tighter together, which allows the packages of the chips to be smaller sideways. It doesn’t change the height of the chips.
And yet not only did the original article misunderstand that sideways isn’t height, they also thought that making the chip packages narrower will directly lead to the phone getting slimmer.